Semiconductor memory device and method of operating the same

ABSTRACT

There may be provided an electronic device, and more particularly, a semiconductor memory device and a method of operating the same. The semiconductor memory device may include a memory cell array including a plurality of memory cells. The semiconductor memory device may include an operation control signal generator configured to receive a request for performing a target operation from the controller configured to control the semiconductor memory device and to generate a synchronizing signal for performing the target operation. The semiconductor memory device may include a temperature detect circuit configured to detect temperatures of the plurality of memory cells in response to the synchronizing signal.

CROSS-REFERENCE TO RELATED APPLICATION

The present application is a continuation application of U.S.application Ser. No. 15/214,631, filed on Jul. 20, 2016, and claimspriority under 35 U.S.C. § 119(a) to Korean patent application number10-2016-0010906 filed on Jan. 28, 2016 in the Korean IntellectualProperty Office, the entire disclosure of which is incorporated hereinby reference.

BACKGROUND 1. Technical Field

Various embodiments may generally relate to an electronic device, andmore particularly, to a semiconductor memory device and a method ofoperating the semiconductor memory device.

2. Related Art

A semiconductor memory device is implemented by using a semiconductorsuch as silicon (Si), germanium (Ge), gallium arsenide (GaAs), andindium phosphide (InP). The semiconductor memory device is divided intoa volatile memory device and a nonvolatile memory device.

In the volatile memory device, when power supply is cut off, stored datais lost. The volatile memory device may be a static random access memory(SRAM), a dynamic RAM (DRAM), or a synchronous DRAM (SDRAM). In thenonvolatile memory device, although power supply is cut off, stored datais maintained. The nonvolatile memory device may be a read only memory(ROM), a programmable ROM (PROM), an electrically programmable ROM(EPROM), an electrically erasable and programmable ROM (EEPROM), a flashmemory, a phase-change RAM (PRAM), a magnetic RAM (MRAM), a resistiveRAM (RRAM), or a ferroelectric RAM (FRAM). The flash memory is dividedinto a NOR type flash memory and a NAND type flash memory.

SUMMARY

A method of operating a semiconductor memory device including aplurality of memory cells may be provided. The method may includereceiving externally from the semiconductor memory device, with anoperation control signal generator, a request for performing a targetoperation. The method may include generating, with the operation controlsignal generator, a synchronizing signal for performing the targetoperation. The method may include detecting, with a temperature detectcircuit, temperatures of memory cells included in the semiconductormemory device in response to the synchronizing signal.

In an embodiment, a semiconductor memory device may be provided. Thesemiconductor memory device may include a memory cell array including aplurality of memory cells. The semiconductor memory device may includean operation control signal generator configured to receive a request,externally from the semiconductor memory device, for performing a targetoperation and to generate a synchronizing signal for performing thetarget operation. The semiconductor memory device may include atemperature detect circuit configured to detect temperatures of theplurality of memory cells in response to the synchronizing signal.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a block diagram illustrating a representation of an example ofa configuration of a memory system.

FIG. 2 is a block diagram illustrating a representation of an example ofa semiconductor memory device according to an embodiment.

FIG. 3 is a view illustrating a representation of an example of astructure of the memory cell array of FIG. 2.

FIG. 4 is a view illustrating a representation of an example of anembodiment of a structure of the memory cell array of FIG. 2.

FIG. 5 is a view illustrating a representation of an example of anembodiment of a structure of the memory cell array of FIG. 2.

FIG. 6 is a block diagram illustrating a representation of an example ofa structure of a temperature detect circuit 130 of a semiconductormemory device according to an embodiment.

FIG. 7 is a block diagram illustrating a representation of an example ofa structure of the enable circuit of FIG. 6.

FIG. 8 is a view illustrating a representation of an example of anoperation of the operation control signal generator of FIG. 2.

FIG. 9 is a flowchart illustrating a representation of an example of amethod of a semiconductor memory device outputting a temperaturedetection enable signal.

FIG. 10 is a view illustrating a representation of an example of thetiming of an input and output signal of an enable circuit of asemiconductor memory device.

FIG. 11 is a block diagram illustrating a representation of an exampleof a memory system including the semiconductor memory device of FIG. 2.

FIG. 12 is a block diagram illustrating a representation of an exampleof an application example of the memory system of FIG. 11.

FIG. 13 is a block diagram illustrating a representation of an exampleof a computing system including the memory system illustrated withreference to FIG. 12.

DETAILED DESCRIPTION

The concepts will now be described more fully with reference to theaccompanying drawings, in which examples of embodiments are illustrated.The concepts may, however, be embodied in many different forms andshould not be construed as limited to the examples of embodiments setforth herein. Rather, these embodiments are provided so that thisdisclosure will be thorough and complete, and will fully convey thescope of the concepts to one of ordinary skill in the art.

It will be understood that, although the terms first and second, etc.,may be used herein to describe various elements, these elements shouldnot be limited by these terms. These terms are only used to distinguishone element from another element. For example, a first element may benamed a second element and similarly a second element may be named afirst element without departing from the scope of the disclosure.

It will also be understood that when an element is referred to as being“on” another element, it can be directly on the other element, orintervening elements may also be present. On the other hand, when anelement is referred to as being “immediately on” or as “directlycontacting” another element, it can be understood that interveningelements do not exist. Other expressions describing a relationshipbetween elements, for example, “between” and “directly between” may beinterpreted as described above.

Unless otherwise defined, terms such as “include” and “have” are forrepresenting that characteristics, numbers, steps, operations, elements,and parts described in the specification or a combination of the aboveexist. It may be interpreted that one or more other characteristics,numbers, steps, operations, elements, and parts or a combination of theabove may be added.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art.

In describing the embodiments, if an embodiment has been well known inthe art and technical contents are not directly related to an embodimentof the present disclosure, descriptions thereof will be omitted. This isto allow the embodiment of the disclosure to be clearly understoodwithout obscuring the gist of the embodiments of the present disclosure.

An embodiment may relate to a semiconductor memory device with anincreased operation speed and a method of operating the same.

Examples of embodiments will now be described more fully hereinafterwith reference to the accompanying drawings; however, they may beembodied in different forms and should not be construed as limited tothe embodiments set forth herein. Rather, these embodiments are providedso that this disclosure will be thorough and complete, and will fullconvey the scope of the examples of embodiments to those skilled in theart.

In the drawing figures, dimensions may be exaggerated for clarity ofillustration. It will be understood that when an element is referred toas being “between” two elements, it can be the only element between thetwo elements, or one or more intervening elements may also be present.Like reference numerals refer to like elements throughout.

Hereinafter, embodiments will be described in detail with reference tothe accompanying drawings.

FIG. 1 is a block diagram illustrating a configuration of a memorysystem 50.

Referring to FIG. 1, the memory system 50 includes a semiconductormemory device 100 and a controller 200.

The semiconductor memory device 100 operates in response to control ofthe controller 200. The semiconductor memory device 100 includes amemory cell array having a plurality of memory blocks.

The semiconductor memory device 100 may be a NAND flash memory, avertical NAND flash memory, a NOR flash memory, a resistive randomaccess memory (RRAM), a phase-change RAM (PRAM), a magneto-resistive RAM(MRAM), a ferroelectric RAM (FRAM), or a spin transfer torque RAM(STT-RAM).

The semiconductor memory device 100 according to an example of anembodiment may be implemented by a three-dimensional array structure. Anembodiment may be applied to a charge trap flash (CTF) in which a chargestorage layer is formed of an insulating layer as well as a flash memorydevice in which a charge storage layer is formed of a conductivefloating gate (FG).

The semiconductor memory device 100 receives a command and an addressfrom the controller 200 through a channel and accesses a region selectedby the address in the memory cell array. The semiconductor memory device100 performs an internal operation corresponding to the command on theregion selected by the address.

For example, the semiconductor memory device 100 may perform a programoperation, a read operation, and an erase operation. During the programoperation, the semiconductor memory device 100 programs data to theregion selected by the address. During the read operation, thesemiconductor memory device 100 reads data from the region selected bythe address. During the erase operation, the semiconductor memory device100 erases data stored in the region selected by the address.

Threshold voltages of the memory cells included in the semiconductormemory device 100 may vary in accordance with an external environmentsuch as temperature, humidity, pressure, and electromagnetic force. Forexample, the threshold voltages of the memory cells may vary inaccordance with a case in which the data is programmed at hightemperature and a case in which the data is programmed at lowtemperature or a case in which the data is read at high temperature anda case in which the data is read at low temperature. Therefore, in orderto compensate for a change in characteristic of a memory cell inaccordance with temperature or to use the change in characteristic ofthe memory cell in accordance with the temperature for controlling thememory cell, the semiconductor memory device 100 needs to continuouslymonitor temperatures of the memory cells.

The semiconductor memory device 100 includes a temperature detectcircuit 130. The temperature detect circuit 130 detects temperature ofthe memory cell array of the semiconductor memory device 100. Thetemperature detect circuit 130 may include a temperature sensor circuitfor detecting the temperatures of the memory cells of the semiconductormemory device 100. The temperature detect circuit 130 may detect thetemperatures of the memory cells in response to a signal input from thecontroller 200 or internal signals of the semiconductor memory device100. The temperature detect circuit 130 outputs temperature informationto a volatile memory storing the temperature information obtained bydetecting the temperatures of the memory cells or a place requiring thetemperature information.

According to various embodiments, the controller 200 may be connected toa plurality of semiconductor memory devices 100. In this case, thecontroller 200 may transmit a chip enable (CE) signal in order to selectthe semiconductor memory device 100 to be used. When the CE signal isinput, the semiconductor memory device 100 is selected by the controller200. The CE signal may be input to a CE pin of the semiconductor memorydevice 100. According to an embodiment, the temperature detect circuit130 may detect the temperatures of the memory cells in response to atleast one of the CE signal and the internal signals.

According to an embodiment, the controller 200 controls thesemiconductor memory device 100 to perform the program operation, theread operation, or the erase operation. During the program operation,the controller 200 provides a program command, an address, and data tothe semiconductor memory device 100 through a channel CH. During theread operation, the controller 200 provides a read command and anaddress to the semiconductor memory device 100 through the channel CH.During the erase operation, the controller 200 provides an erase commandand an address to the semiconductor memory device 100 through thechannel CH.

According to an embodiment, the controller 200 may include elements suchas a RAM, a processing unit, a host interface, and a memory interface.The RAM is used as at least one of an operation memory of the processingunit, a cache memory between the semiconductor memory device 100 and ahost, and a buffer memory between the semiconductor memory device 100and the host. The processing unit controls an entire operation of thecontroller 200.

The host interface includes a protocol for exchanging data between thehost and the controller 200. According to an embodiment, the controller200 communicates with the host through at least one of various interfaceprotocols such as a universal serial bus (USB) protocol, a multimediacard (MMC) protocol, a peripheral component interconnection (PCI)protocol, a PCI-express (PCI-E) protocol, an advanced technologyattachment (ATA) protocol, a serial-ATA protocol, a parallel-ATAprotocol, a small computer small interface (SCSI) protocol, an enhancedsmall disk interface (ESDI) protocol, an integrated drive electronics(IDE) protocol, and a private protocol.

The memory interface interfaces with the semiconductor memory device100. For example, the memory interface includes a NAND interface or aNOR interface.

FIG. 2 is a block diagram illustrating a representation of an example ofa semiconductor memory device according to an embodiment. FIG. 3 is aview illustrating a representation of an example of a structure of thememory cell array of FIG. 2.

Referring to FIG. 2, the semiconductor memory device 100 includes amemory cell array 110 and a peripheral circuit 120.

The memory cell array 110 includes a plurality of memory blocks BLK1 toBLKz. The plurality of memory blocks BLK1 to BLKz are connected to anaddress decoder 121 through row lines RL and are connected to a read andwrite circuit 123 through bit lines BL1 to BLm. Each of the plurality ofmemory blocks BLK1 to BLKz includes a plurality of memory cells.According to an embodiment, the plurality of memory cells arenonvolatile memory cells.

The plurality of memory cells included in the memory cell array 110 maybe divided into a plurality of blocks in accordance with purposes to beused. Here, the plurality of blocks may be divided into main blocks andextra blocks and various set information items on operations of thememory cells may be stored in the extra blocks.

Referring to FIG. 3, the first to zth memory blocks BLK1 to BLKz arecommonly connected to the first to mth bit lines BL1 to BLm. Referringto FIG. 2, for convenience sake, elements included in the first memoryblock BLK1 among the plurality of memory blocks BLK1 to BLKz areillustrated and elements included in each of the remaining memory blocksBLK2 to BLKz are omitted. Each of the remaining memory blocks BLK2 toBLKz is configured like or similar to the first memory block BLK1.

The memory block BLK1 includes a plurality of cell strings CS1_1˜CS1_m.The first to mth cell strings CS1_1˜CS1_m are respectively connected tothe first to mth bit lines BL1 to BLm.

Each of the first to mth cell strings CS1_1˜CS1_m includes a drainselection transistor DST, a plurality of serially connected memory cellsMC1 to MCn, and a source selection transistor SST. The drain selectiontransistor DST is connected to a drain selection line DSL1. The first tonth memory cells MC1 to MCn are respectively connected to the first tonth word lines WL1 to WLn. The source selection transistor SST isconnected to a source selection line SSL1. A drain side of the drainselection transistor DST is connected to a corresponding bit line. Drainselection transistors of the first to mth cell strings CS1_1˜CS1_m arerespectively connected to the first to mth bit lines BL1 to BLm. Asource side of the source selection transistor SST is connected to acommon source line CSL. According to an embodiment, the common sourceline CSL may be commonly connected to the first to zth memory blocksBLK1 to BLKz.

The drain selection line DSL1, the first to nth word lines WL1 to WLn,and the source selection line SSL1 are included in the row lines RL ofFIG. 2. The drain selection line DSL1, the first to nth word lines WL1to WLn, and the source selection line SSL1 are controlled by the addressdecoder 121. The common source line CSL (see FIG. 4) is controlled by acontrol logic 125 (see FIG. 2). The first to mth bit lines BL1 to BLmare controlled by the read and write circuit 123.

Referring to FIG. 2, the peripheral circuit 120 includes the addressdecoder 121, the voltage generator 122, the read and write circuit 123,a data input and output circuit 124, the control logic 125, and thetemperature detect circuit 130.

The address decoder 121 is connected to the memory cell array 110through the row lines RL. The address decoder 121 operates in responseto control of the control logic 125. The address decoder 121 receives anaddress ADDR through the control logic 125.

According to an embodiment, programing and read operations of thesemiconductor memory device 100 are performed in units of pages.

During the program and read operations, the address ADDR received by thecontrol logic 125 includes a block address and a row address. Theaddress decoder 121 decodes the block address in the received addressADDR. The address decoder 121 selects one of the memory blocks BLK1 toBLKz in accordance with the decoded block address.

The address decoder 121 decodes the row address in the received addressADDR. The address decoder 121 applies voltages received from the voltagegenerator 122 to the row lines RL in accordance with the decoded rowaddress and selects a word line of the selected memory block.

During the program operation, the address decoder 121 applies a programpulse to the selected word line and applies a pass pulse lower than theprogram pulse to non-selected word lines. During the read operation, theaddress decoder 121 applies a read voltage to the selected word line andapplies a pass voltage higher than the read voltage to the non-selectedword lines.

According to an embodiment, the erase operation of the semiconductormemory device 100 is performed in units of memory blocks. During theerase operation, the address ADDR includes the block address. Theaddress decoder 121 decodes the block address and selects a memory blockin accordance with the decoded block address.

According to an embodiment, the address decoder 121 may include a blockdecoder, a word line decoder, and an address buffer.

The voltage generator 122 generates a plurality of voltages by using anexternal power source voltage supplied to the semiconductor memorydevice 100. The voltage generator 122 operates in response to thecontrol of the control logic 125.

According to an embodiment, the voltage generator 122 regulates theexternal power source voltage and may generate an internal power sourcevoltage. The internal power source voltage generated by the voltagegenerator 122 is used as an operating voltage of the semiconductormemory device 100.

According to an embodiment, the voltage generator 122 may generate theplurality of voltages by using the external power source voltage or theinternal power source voltage. For example, the voltage generator 122includes a plurality of pumping capacitors that receive the internalpower source voltage and generates the plurality of voltages byselectively activating the plurality of pumping capacitors in responseto the control of the control logic 125. The plurality of generatedvoltages are applied to the selected word line by the address decoder121.

During the program operation, the voltage generator 122 generates a highvoltage program pulse and a pass pulse lower than the program pulse.During the read operation, the voltage generator 122 generates a readvoltage and a pass voltage higher than the read voltage. During theerase operation, the voltage generator 122 generates an erase voltage.

The read and write circuit 123 includes first to mth page buffers PB1 toPBm. The first to mth page buffers PB1 to PBm are connected to thememory cell array 110 through the first to mth bit lines BL1 to BLm. Thefirst to mth page buffers PB1 to PBm operate in response to the controlof the control logic 125.

The first to mth page buffers PB1 to PBm communicate data with the datainput and output circuit 124. During the program operation, the first tomth page buffers PB1 to PBm receive data DATA to be stored through thedata input and output circuit 124 and data lines DL.

During the program operation, the first to mth page buffers PB1 to PBmtransmit the data DATA received through the data input and outputcircuit 124 to selected memory cells through the bit lines BL1 to BLmwhen a program pulse is applied to a selected word line. The memorycells of a selected page are programmed in accordance with the receiveddata DATA. A memory cell connected to a bit line to which a programallow voltage (for example, a ground voltage) is applied has anincreased threshold voltage. A threshold voltage of a memory cellconnected to a bit line to which a program prevent voltage (for example,a power source voltage) is applied is maintained. During a programverify operation, the first to mth page buffers PB1 to PBm read pagedata from the selected memory cells through the bit lines BL1 to BLm.

During the read operation, the read and write circuit 123 reads the dataDATA from the memory cells of the selected page through the bit lines BLand outputs the read data DATA to the input and output circuit 124.During the erase operation, the read and write circuit 123 may make thebit lines BL float.

According to an embodiment, the read and write circuit 123 may include acolumn select circuit.

The data input and output circuit 124 is connected to first to mth pagebuffers PB1 to PBm through the data lines DL. The data input and outputcircuit 124 operates in response to the control of the control logic125. During a program, the data input and output circuit 124 receivesthe data DATA to be stored from an external controller (notillustrated).

The control logic 125 is connected to the address decoder 121, thevoltage generator 122, the read and write circuit 123, and the datainput and output circuit 124. The control logic 125 may control anentire operation of the semiconductor memory device 100. The controllogic 125 receives the command CMD and the address ADDR from theexternal controller. The control logic 125 controls the address decoder121, the voltage generator 122, the read and write circuit 123, and thedata input and output circuit 124 in response to the command CMD. Thecontrol logic 125 transmits the address ADDR to the address decoder 121.

According to an embodiment, the control logic 125 may further include anoperation control signal generator 126 (see FIG. 8) in order to executethe command CMD received from the external controller.

The operation control signal generator 126 may generate synchronizingsignals for executing the command CMD received from the externalcontroller. According to an embodiment, the generated synchronizingsignals may be an operation start pulse informing that an operationstarts and an operation end pulse informing that an operation ends.

The operation control signal generator 126 generates the operation startpulse that is a synchronizing signal representing that an operation ofthe peripheral circuit 120 starts and the operation end pulse that is asynchronizing signal representing that the operation of the peripheralcircuit 120 ends in accordance with a write enable (WE) signal and aread enable (RE) signal that are received from the external controllerand may transmit the generated signals to the peripheral circuit 120.

The temperature detect circuit 130 detects temperature of the memorycell array 110. The temperature detect circuit 130 may include atemperature sensor circuit for detecting the temperatures of the memorycells. The temperature detect circuit 130 may detect the temperatures ofthe memory cells in response to signals input from the outside or theinternal signals of the semiconductor memory device 100. According to anembodiment, the temperature detect circuit 130 may receive the operationstart pulse and the operation end pulse that are generated by theoperation control signal generator 126. The temperature detect circuit130 may output the temperature information to the volatile memorystoring the temperature information obtained by detecting thetemperatures of the memory cells or the place requiring the temperatureinformation. According to an embodiment, the temperature detect circuit130 may transmit the detected temperature information to the controllogic 125 or may transmit the temperature information to an arbitraryregister in which the temperature information is to be stored. Anoperation and a structure of the temperature detect circuit 130 will bedescribed below with reference to FIGS. 6 to 9.

FIG. 4 is a view illustrating a representation of an example of anembodiment of a structure of the memory cell array 110 of FIG. 2.

Referring to FIG. 4, the memory cell array 110 includes the plurality ofmemory blocks BLK1 to BLKz. In FIG. 4, for convenience sake, an internalconfiguration of the first memory block BLK1 is illustrated and internalconfigurations of the remaining memory blocks BLK2 to BLKz are omitted.The second to zth memory blocks BLK2 to BLKz are configured like orsubstantially similar to the first memory block BLK1.

Referring to FIG. 4, the first memory block BLK1 includes a plurality ofcell strings CS11 to CS1 m and CS21 to CS2 m. According to anembodiment, the plurality of cell strings CS11 to CS1 m and CS21 to CS2m may be U-shaped. In the first memory block BLK1, m cell strings arearranged in a row direction (that is, a +X direction). Referring to FIG.4, it is illustrated that two cell strings are arranged in a columndirection (a +Y direction). However, no less than three cell strings maybe arranged in the column direction.

Each of the plurality of cell strings CS11 to CS1 m and CS21 to CS2 mincludes at least one source select transistor SST, first to nth memorycells MC1 to MCn, a pipe transistor PT, and at least one drain selecttransistor DST.

The select transistors SST and DST and the memory cells MC1 to MCn mayhave similar structures. According to an embodiment, each of the selecttransistors SST and DST and the memory cells MC1 to MCn may include achannel layer, a tunneling insulating layer, a charge storage layer, anda blocking insulating layer. According to an embodiment, a pillar forproviding the channel layer may be provided in each cell string.According to an embodiment, the pillar for providing at least one of thechannel layer, the tunneling insulating layer, the charge storage layer,and the blocking insulating layer may be provided in each cell string.

The source select transistor SST of each cell string is connectedbetween the common source line CSL and the memory cells MC1 to MCp.

According to an embodiment, source select transistors of cell stringsarranged in the same row are connected to a source select line thatextends in the row direction and source select transistors of cellstrings arranged in different rows are connected to different sourceselect lines. Referring to FIG. 4, the source select transistors of thecell strings CS11 to CS1 m in a first row are connected to the firstsource select line SSL1. The source select transistors of the cellstrings CS21 to CS2 m in a second row are connected to a second sourceselect line SSL2.

According to an embodiment, the source select transistors of the cellstrings CS11 to CS1 m and CS21 to CS2 m may be commonly connected to onesource select line.

The first to nth memory cells MC1 to MCn of each cell string areconnected between the source select transistor SST and the drain selecttransistor DST.

The first to nth memory cells MC1 to MCn are divided into the first topth memory cells MC1 to MCp and (p+1)th to nth memory cells MCp+1 toMCn. The first to pth memory cells MC1 to MCp are sequentially arrangedin a direction opposite to a +Z direction and are serially connectedbetween the source select transistor SST and the pipe transistor PT. The(p+1)th to nth memory cells MCp+1 to MCn are sequentially arranged inthe +Z direction and are serially connected between the pipe transistorPT and the drain select transistor DST. The first to pth memory cellsMC1 to MCp and the (p+1)th to nth memory cells MCp+1 to MCn areconnected through the pipe transistor PT. Gates of the first to nthmemory cells MC1 to MCn of each cell string are respectively connectedto the first to nth word lines WL1 to WLn.

According to an embodiment, at least one of the first to nth memorycells MC1 to MCn may be used as a dummy memory cell. When the dummymemory cell is provided, a voltage or a current of a corresponding cellstring may be stably controlled. Therefore, reliability of data storedin the memory block BLK1 may improve.

A gate of the pipe transistor PT of each cell string is connected to apipe line PL.

The drain select transistor DST of each cell string is connected betweena corresponding bit line and the memory cells MC(p+1) to MCn. Cellstrings arranged in the row direction are connected to a drain selectline that extends in the row direction. Drain select transistors of thecell strings CS11 to CS1 m of the first row are connected to the firstdrain select line DSL1. Drain select transistors of the cell stringsCS21 to CS2 m of the second row are connected to the second drain selectline DSL2.

Cell strings arranged in the column direction are connected to a bitline that extends in the column direction. Referring to FIG. 4, the cellstrings CS11 and CS21 in a first column are connected to the first bitline BL1. The cell strings CS1 m and CS2 m in an mth column areconnected to the mth bit line BLm.

Memory cells connected to the same word line in the cell stringsarranged in the row direction form one page. For example, memory cellsconnected to the first word line WL1 among the cell strings CS11 to CS1m in the first row form one page. Memory cells connected to the firstword line WL1 among the cell strings CS21 to CS2 m in the second rowform one page. One of the drain select lines DSL1 and DSL2 is selectedso that cell strings arranged in one row direction are selected. One ofthe word lines WL1 to WLn is selected so that one page is selected amongthe selected cell strings.

FIG. 5 is a view illustrating an embodiment of a structure of the memorycell array 110 of FIG. 2.

Referring to FIG. 5, the memory cell array 110 includes a plurality ofmemory blocks BLK1′ to BLKz′. In FIG. 5, for convenience sake, aninternal configuration of the first memory block BLK1′ is illustratedand internal configurations of the remaining memory blocks BLK2′ toBLKz′ are omitted. The second to zth memory blocks BLK2′ to BLKz′ areconfigured like or similar to the first memory block BLK1′.

The first memory block BLK1′ includes a plurality of cell strings CS11′to CS1 m′ and CS21′ to CS2 m′. The plurality of cell strings CS11′ toCS1 m′ and CS21′ to CS2 m′ extend in the +Z direction. In the firstmemory block BLK1, m cell strings are arranged in the +X direction.Referring to FIG. 5, it is illustrated that two cell strings arearranged in the +Y direction. However, no less than three cell stringsmay be arranged in the column direction.

Each of the plurality of cell strings CS11′ to CS1 m′ and CS21′ to CS2m′ includes at least one source select transistor SST, first to nthmemory cells MC1 to MCn, and at least one drain select transistor DST.

The source select transistor SST of each cell string is connectedbetween the common source line CSL and the memory cells MC1 to MCn.Source select transistors of cell strings arranged in the same row areconnected to the same source select line. The source select transistorsof the cell strings CS11′ to CS1 m′ in a first row are connected to thefirst source select line SSL1. The source select transistors of the cellstrings CS21′ to CS2 m′ in a second row are connected to a second sourceselect line SSL2. According to an embodiment, the source selecttransistors of the cell strings CS11′ to CS1 m′ and CS21′ to CS2 m′ maybe commonly connected to one source select line.

The first to nth memory cells MC1 to MCn of each cell string areserially connected between the source select transistor SST and thedrain select transistor DST. Gates of the first to nth memory cells MC1to MCn are respectively connected to the first to nth word lines WL1 toWLn.

According to an embodiment, at least one of the first to nth memorycells MC1 to MCn may be used as a dummy memory cell. When the dummymemory cell is provided, a voltage or a current of a corresponding cellstring may be stably controlled. Therefore, reliability of data storedin the memory block BLK1′ improves.

The drain select transistor DST of each cell string is connected betweena corresponding bit line and the memory cells MC1 to MCn. Drain selecttransistors of the cell strings arranged in the row direction areconnected to a drain select line that extends in the row direction.Drain select transistors of the cell strings CS11′ to CS1 m′ of thefirst row are connected to the first drain select line DSL1. Drainselect transistors of the cell strings CS21′ to CS2 m′ of the second roware connected to the second drain select line DSL2.

As a result, the memory block BLK1′ of FIG. 5 has an equivalent circuitsimilar to or substantially similar to the memory block BLK1 of FIG. 4excluding that the pipe transistor PT is excluded from each cell string.

FIG. 6 is a block diagram illustrating a structure of a temperaturedetect circuit 130 of a semiconductor memory device according to anembodiment.

Referring to FIG. 6, the temperature detect circuit 130 may include anenable circuit 131, a detect circuit 132, and an output circuit 133. InFIG. 6, it is illustrated that the temperature detect circuit 130includes only the enable circuit 131, the detect circuit 132, and theoutput circuit 133. However, the temperature detect circuit 130 mayfurther include various modules or circuits in accordance with anoperation thereof.

The enable circuit 131 generates a temperature detection enable signalso that the detect circuit 132 detects temperatures of memory cells. Thetemperature detection enable signal generated by the enable circuit 131is transmitted to the detect circuit 132. The enable circuit 131generates the temperature detection enable signal in response to atleast one of the CE signal or the operation end pulse. A structure ofthe enable circuit 131 will be described below with reference to FIG. 9.

The detect circuit 132 receives the temperature detection enable signalgenerated by the enable circuit 131 in response to at least one of theCE signal and the operation end pulse. The detect circuit 132 mayinclude a temperature sensor for detecting the temperatures of thememory cells. Since a method or a principle for the detect circuit 132detecting the temperatures of the memory cells is not limited thereto, adescription thereof will not be given.

According to an embodiment, the detect circuit 132 may continuouslydetect the temperatures while the temperature detection enable signal isinput or may detect the temperatures by a predetermined number of timesor time when the temperature detection enable signal is sensed.

The output circuit 133 outputs information on the temperatures detectedby the detect circuit 132 to a module or a device other than thetemperature detect circuit 130.

FIG. 7 is a block diagram illustrating a representation of an example ofa structure of the enable circuit 131 of FIG. 6.

Referring to FIG. 7, the enable circuit 131 may include an inversioncircuit 101, a selection output circuit 102, and a flip-flop 103.

The inversion circuit 101 receives the CE signal, inverts the receivedCE signal, and outputs the inverted CE signal to the selection outputcircuit 102. The inversion circuit 101 outputs “low” when the CE signalhas a logic value “high” and may output “high” when the CE signal has alogic value “low”. In accordance with the output of the inversioncircuit 101, in a state in which the semiconductor memory device isselected by the controller, that is, in a state in which the CE signalis input, the output of the inversion circuit 101 may have a logic value“low”. When the semiconductor memory device is not selected, since theCE signal is disabled, the output of the inversion circuit 101 may be alogic value “high”. According to an embodiment, the inversion circuit101 may continuously invert the input CE signal to transmit the invertedCE signal and may detect a rising or falling edge to transmit a signalto the selection output circuit 102 only when the rising or falling edgeis detected. According to an embodiment, the inversion circuit 101 maybe, for example but not limited to, an inverter gate.

The selection output circuit 102 receives the output of the inversioncircuit 101 and the operation end pulse that is the internal signal ofthe semiconductor memory device. The selection output circuit 102 has anarbitrary output value when one of the output of the inversion circuit101 and the operation end pulse is enabled. The output of the selectionoutput circuit 102 may have a logic value “high” or “low”.

The operation end pulse may be an internal signal generated when thesemiconductor memory device stops performing an operation requested bythe controller. According to an embodiment, the operation end pulse maybe generated by the operation control signal generator 126 of FIGS. 2and 8 (i.e., control logic 125 including the operation control signalgenerator 126). When the operation end pulse is enabled, the memorycells of the semiconductor memory device maintain to be idle withoutoperating. Since one of inputs of the selection output circuit 102 isthe output of the inversion circuit 101, the selection output circuit102 generates an output when an operation ends and the operation endpulse is enabled although the semiconductor memory device is selected bythe controller. According to an embodiment, when one of input signals isinput, the selection output circuit 102 may continuously maintain theoutput, detects a rising or falling edge of the one of the inputsignals, and may have the output only when the rising or falling edge isdetected. According to an embodiment, the selection output circuit 102may be, for example but not limited to, a logic gate. The logic gate ofthe selection output circuit 102 may include for example but not limitedto a logic gate configured to perform an OR operation.

The flip-flop 103 receives the output of the selection output circuit102 and outputs the temperature detection enable signal. The flip-flop103 maintains an arbitrary output and, when an input signal changes, mayreflect the change to the output. A reset (Reset) input to the flip-flop103 is for initialization when power is turned off in the semiconductormemory device or the temperature detect operation is completed.

Referring to FIG. 7, the flip-flop 103 is illustrated. However, anyelectronic circuit having a latch function capable of outputting thetemperature detection enable signal may be used as the flip-flop 103.

According to an embodiment, a phase of a signal input to the flip-flop103 is not fixed in order to output the temperature detection enablesignal. That is, the rising and/or falling edge may operate and thecircuit of FIG. 7 may be changed into various combination circuits forcontrolling the CE signal and the operation end pulse to be suitable forphases.

The chip enable CE signal and the operation end pulse include all thesignals capable of representing functions thereof.

FIG. 8 is a view illustrating a representation of an example of anoperation of the operation control signal generator of FIG. 2 includedin the control logic 125.

The semiconductor memory device may receive commands corresponding tocorresponding operations from the external controller in order toperform operations requested by the host. For example, the semiconductormemory device may receive a command representing a specific operation,an address representing an address of a memory cell that performs acorresponding operation, and data used for the command from the externalcontroller. When the semiconductor memory device receives the command,the address, and the data from the controller, the semiconductor memorydevice performs a corresponding operation. In order for thesemiconductor memory device to perform the corresponding operation, theoperation control signal generator 126 generates a synchronizing signalfor driving peripheral circuits included in the semiconductor memorydevice and may transmit the generated synchronizing signal to theperipheral circuits.

The operation control signal generator 126 receives a start enablesignal and an end enable signal. The start enable signal is directlyreceived from the external controller or may be received in a method inwhich the control logic receives the signals received from the externalcontroller.

According to an embodiment, the start enable signal may be one of thewrite enable signal WE or the read enable signal RE transmitted by theexternal controller. During the program operation or the eraseoperation, the start enable signal may be the write enable signal WE.During the read operation, the start enable signal may be the readenable signal RE.

The operation control signal generator 126 generates the operation startpulse when the start enable signal is input. According to an embodiment,the operation start pulse may be transmitted to the temperature detectcircuit 130 of FIG. 2.

When an operation requested by the external controller stops beingperformed, the operation control signal generator 126 generates theoperation end pulse and may transmit the generated operation end pulseto the peripheral circuit 120. When the end enable signal is received,the operation control signal generator 126 generates the operation endpulse and may transmit the generated operation end pulse to theperipheral circuit 120.

According to an embodiment, the end enable signal may be input from theperipheral circuit 120. For example, during the program operation or theerase operation, when data is input to a state register representingpass or fail, the end enable signal may be input to the operationcontrol signal generator 126 in response to the input data. During theread operation, when data to be transmitted to the external controlleris input to a data register, the end enable signal may be input.

The operation control signal generator 126 generates the operation endpulse when the end enable signal is input. According to an embodiment,the operation end pulse may be transmitted to the temperature detectcircuit 130 of FIG. 2.

FIGS. 9 and 10 are views illustrating representations of examples ofoperations of a semiconductor memory device according to an embodiment.

FIG. 9 is a flowchart illustrating a representation of an example of amethod of a semiconductor memory device outputting a temperaturedetection enable signal. FIG. 10 is a view illustrating a representationof an example of the timing of an input and output signal of an enablecircuit of a semiconductor memory device.

Referring to FIGS. 9 and 10, the semiconductor memory device maydetermine whether the CE signal is enabled 801. When the CE signal isenabled, it may be noted that the semiconductor memory device isselected by the controller.

When the CE signal is transited from being disabled to being enabled,the semiconductor memory device outputs the temperature detection enablesignal 803. That is, the semiconductor memory device outputs thetemperature detection enable signal according to the rising edge of theCE signal.

For example, at a point of time t1, the CE signal of the semiconductormemory device is activated. When the CE signal is activated, it isestimated that the controller requests the semiconductor memory deviceto perform an operation. However, delay may occur between a point oftime at which the CE signal is transited to being enabled and a point oftime t2 at which the operation requested by the controller starts inaccordance with signal processing between the controller and asemiconductor memory or in accordance with the memory cell of thesemiconductor memory device maintaining a standby state for a time whenthe controller transmits the command, the address, and the data to thesemiconductor memory. The enable circuit of the temperature detectcircuit of the semiconductor memory device outputs the temperaturedetection enable signal in response to the CE signal (t1 to t2).According to an embodiment, the temperatures of the memory cells of thesemiconductor memory device are detected while the memory cells of thesemiconductor memory device are in standby states by performing atemperature detect operation in response to the CE signal so that it ispossible to reduce time used for detecting the temperatures of thememory cells (initial time save).

In a period t2 to t3, the semiconductor memory device performs a targetoperation. In the target operation, it may be required to perform thetemperature detect operation among the operations requested by thecontroller to the semiconductor memory device. According to anembodiment, the target operation may include a program relatedoperation, a read related operation, and an erase related operation.

In operation 805, the semiconductor memory device may determine whetherthe operation end pulse is generated. That is, when the target operationis completed, the semiconductor memory device transmits the operationend pulse representing that an operation internally ends to thetemperature detect circuit. After the operation end pulse is generated,the semiconductor memory device waits for new requests input from thecontroller (idle). When it is determined in the operation 805 that theoperation end pulse is input, the process proceeds to operation 807 andthe semiconductor memory device outputs the temperature detection enablesignal according to the falling edge of the operation end pulse. Thatis, the semiconductor memory device detects a falling edge of theoperation end pulse and performs the temperature detect operation at apoint of time t3. Therefore, before the subsequent operation start pulseis applied, for a time when the memory cells are in standby states, thesemiconductor memory device performs the temperature detect operation.Therefore, after the temperature detect operation is performed at aninitial stage, the semiconductor memory device detects the temperaturesof the memory cells while every operation end pulse is applied so thatit is possible to reduce time used for detecting the temperatures of thememory cells (next time save).

In operation 809, it is determined whether the CE signal is disabled.When it is determined that the semiconductor memory device is notdisabled, the process proceeds to the operation 805 and thesemiconductor memory device outputs the temperature detection enablesignal.

FIG. 11 is a block diagram illustrating a representation of an exampleof a memory system 1000 including the semiconductor memory device ofFIG. 2.

Referring to FIG. 11, the memory system 1000 includes a semiconductormemory device 1300 and a controller 1200.

The semiconductor memory device 1300 may be configured and operate likethe semiconductor memory device 100 described with reference to FIG. 2.Hereinafter, description of repeated contents will not be given.

The controller 1200 is connected to a host and the semiconductor memorydevice 1300. In response to a request from the host, the controller 1200accesses the semiconductor memory device 1300. For example, thecontroller 1200 controls a read operation, a program operation, an eraseoperation, and a background operation of the semiconductor memory device1300. The controller 1200 controls interface between the semiconductormemory device 1300 and the host. The controller 1200 drives firmware forcontrolling the semiconductor memory device 1300.

The controller 1200 includes a random access memory (RAM) 1210, aprocessing unit 1220, a host interface 1230, a memory interface 1240,and an error correcting block 1250.

The RAM 1210 is used as at least one of an operation memory of theprocessing unit 1220, a cache memory between the semiconductor memorydevice 1300 and the host, and a buffer memory between the semiconductormemory device 1300 and the host.

The processing unit 1220 controls an entire operation of the controller1200.

The processing unit 1220 randomizes data received from the host. Forexample, the processing unit 1220 randomizes the data received from thehost by using a randomizing seed. The randomized data is provided to thesemiconductor memory device 1300 as the data DATA (refer to FIG. 1) tobe stored and is programed in the memory cell array 110 (refer to FIG.1).

The processing unit 1220 randomizes the data received from thesemiconductor memory device 1300 during the read operation. For example,the processing unit 1220 derandomizes the data received from thesemiconductor memory device 1300 by using a derandomizing seed. Thederandomized data is output to the host.

According to an embodiment, the processing unit 1220 may performrandomize and derandomize by driving software or firmware.

The host interface 1230 includes protocols for exchanging data betweenthe host and the controller 1200. According to an example of anembodiment, the controller 1200 communicates with the host through atleast one of various interface protocols such as a universal serial bus(USB) protocol, a multimedia card (MMC) protocol, a peripheral componentinterconnection (PCI) protocol, a PCI-express (PCI-E) protocol, anadvanced technology attachment (ATA) protocol, a serial-ATA (SATA)protocol, a parallel-ATA (PATA) protocol, a small computer smallinterface (SCSI) protocol, an enhanced small disk interface (ESDI)protocol, and an integrated drive electronics (IDE) protocol.

The memory interface 1240 interfaces with the semiconductor memorydevice 1300. For example, the memory interface 1240 includes a NANDinterface or a NOR interface.

The error correcting block 1250 detects errors of the data received fromthe semiconductor memory device 1300 by using an error correcting code(ECC) and corrects the detected errors.

The controller 1200 and the semiconductor memory device 1300 may beintegrated into one semiconductor device. According to an example of anembodiment, the controller 1200 and the semiconductor memory device 1300are integrated into one semiconductor device and may form a memory card.For example, the controller 1200 and the semiconductor memory device1300 are integrated into one semiconductor device and may form a memorycard such as a personal computer memory card international association(PCMCIA) card, a compact flash (CF) card, a smart media card (SM andSMC), a memory stick, a multimedia card (MMC, RS-MMC, and MMCmicro), anSD card (SD, miniSD, microSD, and SDHC), and a universal flash memorydevice (UFS).

The controller 1200 and the semiconductor memory device 1300 areintegrated into one semiconductor device and may form a semiconductordrive (a solid state drive (SSD)). The semiconductor drive (SSD)includes a storage device formed to store data in a semiconductormemory. When the memory system 1000 is used as the semiconductor drive(SSD), an operation speed of the host connected to the memory system1000 remarkably increases.

According to an example, the memory system 1000 is provided as one ofvarious elements of an electronic device such as one of various elementsthat form a computer, an ultra-mobile PC (UMPC), a work station, anet-book, a personal digital assistant (PDA), a portable computer, a webtablet, a wireless phone, a mobile phone, a smart phone, an e-book, aportable multimedia player (PMP), a portable gamer, a navigator, a blackbox, a digital camera, a three-dimensional television set, a digitalaudio recorder, a digital audio player, a digital picture recorder, adigital picture player, a digital video recorder, a digital videoplayer, a device capable of transmitting and receiving information in awireless environment, one of various electronic devices that form a homenetwork, one of various electronic devices that form a computer network,one of various electronic devices that form a telematics network, anRFID device, or a computing system.

According to an example of an embodiment, the semiconductor memorydevice 1300 or the memory system 1000 may be mounted as a package invarious forms. For example, the semiconductor memory device 1300 or thememory system 1000 is packaged in a method such as package on package(PoP), ball grid arrays (BGAs), chip scale packages (CSPs), a plasticleaded chip carrier (PLCC), a plastic dual in line package (PDIP), a diein waffle pack, a die in wafer form, a chip on board (COB), a ceramicdual in line package (CERDIP), a plastic metric quad flat pack (MQFP), athin quad flat pack (TQFP), a small outline integrated circuit (SOIC), ashrink small outline package (SSOP), a thin small outline package(TSOP), a thin quad flat pack (TQFP), a system in package (SIP), amultichip package (MCP), a wafer-level fabricated package (WFP), and awafer-level processed stack package (WSP) and may be mounted.

FIG. 12 is a block diagram illustrating a representation of an exampleof an application example 2000 of the memory system 1000 of FIG. 11.

Referring to FIG. 12, the memory system 2000 includes a semiconductormemory device 2100 and a controller 2200. The semiconductor memorydevice 2100 includes a plurality of semiconductor memory chips. Theplurality of semiconductor memory chips are divided into a plurality ofgroups.

Referring to FIG. 12, it is illustrated that the plurality of groupscommunicate with the controller 2200 through first to kth channels CH1to CHk. Each semiconductor memory chip is configured and operates likeone of the semiconductor memory device 100 described with reference toFIG. 1.

Each group communicates with the controller 2200 through a commonchannel. The controller 2200 is configured like the controller 1200described with reference to FIG. 11 and controls the plurality ofsemiconductor memory chips of the memory device 2100 through theplurality of channels CH1 to CHk.

Referring to FIG. 12, it is illustrated that the plurality ofsemiconductor memory chips are connected to one channel. However, thememory system 200 may be modified so that one semiconductor memory chipis connected to one channel.

Data may be exchanged between a host (Host) and the controller 2200.According to an example of an embodiment, the controller 2200communicates with the host through at least one of various interfaceprotocols such as a universal serial bus (USB) protocol, a multimediacard (MMC) protocol, a peripheral component interconnection (PCI)protocol, a PCI-express (PCI-E) protocol, an advanced technologyattachment (ATA) protocol, a serial-ATA (SATA) protocol, a parallel-ATA(PATA) protocol, a small computer small interface (SCSI) protocol, anenhanced small disk interface (ESDI) protocol, and an integrated driveelectronics (IDE) protocol.

FIG. 13 is a block diagram illustrating a representation of an exampleof a computing system 3000 including the memory system 2000 illustratedwith reference to FIG. 12.

Referring to FIG. 13, the computing system 3000 includes a centralprocessing unit (CPU) 3100, a RAM 3200, a user interface 3300, a powersource 3400, a system bus 3500, and the memory system 2000.

The memory system 2000 is electrically connected to the CPU 3100, theRAM 3200, the user interface 3300, and the power source 3400 through thesystem bus 3500. Data provided through the user interface 3300 orprocessed by the CPU 3100 is stored in the memory system 2000.

Referring FIG. 13, the semiconductor memory device 2100 is illustratedas being connected to the system bus 3500 through the controller 2200.However, the semiconductor memory device 2100 may be directly connectedto the system bus 3500. A function of the controller 2200 is performedby the CPU 3100 and the RAM 3200.

Referring to FIG. 13, it is illustrated that the memory system 2000described with reference to FIG. 12 is provided. However, the memorysystem 2000 may be replaced by the memory system 1000 described withreference to FIG. 12. According to an embodiment, the computing system3000 may include both the memory systems 1000 and 2000 described withreference to FIGS. 11 and 12.

Examples of embodiments have been disclosed herein, and althoughspecific terms are employed, they are used and are to be interpreted ina generic and descriptive sense only and not for purpose of limitation.In some instances, as would be apparent to one of ordinary skill in theart as of the filing of the present application, features,characteristics, and/or elements described in connection with aparticular embodiment may be used singly or in combination withfeatures, characteristics, and/or elements described in connection withother embodiments unless otherwise specifically indicated. Accordingly,it will be understood by those of skill in the art that various changesin form and details may be made without departing from the spirit andscope of the disclosure as set forth in the following claims.

What is claimed is:
 1. A method of operating a semiconductor memorydevice including a plurality of memory cells, the method comprising:receiving a request for performing a target operation from a controllerconfigured to control the semiconductor memory device; generating asynchronizing signal for performing the target operation; and detectingtemperatures of memory cells included in the semiconductor memory devicein response to the synchronizing signal, wherein the target operationincludes at least one of a program related operation, a read relatedoperation, and an erase related operation for the plurality of memorycells.
 2. The method of claim 1, wherein the synchronizing signal is anoperation end pulse generated as the target operation is completed. 3.The method of claim 2, wherein, when the target operation is a programor erase operation, the operation end pulse is generated when a pass ora fail of the program or erase operation is determined.
 4. The method ofclaim 2, wherein, when the target operation is a read operation, theoperation end pulse is generated when fail of the read operation isdetermined or when data read in accordance with the read operation isstored.
 5. The method of claim 1, wherein the detecting of thetemperatures comprises: generating a temperature detection enable signalto control a temperature detect operation for the memory cells inresponse to the synchronizing signal; and detecting the temperatures ofthe memory cells in accordance with the temperature detection enablesignal.
 6. The method of claim 1, further comprising outputting thedetected temperatures of the memory cells to the controller.
 7. Asemiconductor memory device comprising: a memory cell array including aplurality of memory cells; an operation control signal generatorconfigured to receive a request for performing a target operation from acontroller and to generate a synchronizing signal for performing thetarget operation; and a temperature detect circuit configured to detecttemperatures of the plurality of memory cells in response to thesynchronizing signal, wherein the target operation includes at least oneof a program related operation, a read related operation, and an eraserelated operation for the plurality of memory cells.
 8. Thesemiconductor memory device of claim 7, wherein the operation controlsignal generator generates an operation start pulse representing thatthe target operation starts and an operation end pulse representing thatthe target operation is completed.
 9. The semiconductor memory device ofclaim 8, wherein the temperature detect circuit detects the temperaturesof the plurality of memory cells in response to the operation end pulse.10. The semiconductor memory device of claim 8, wherein, when the targetoperation is a program or erase operation, the operation control signalgenerator generates the operation start pulse in response to a writeenable signal received from the controller.
 11. The semiconductor memorydevice of claim 8, wherein, when the target operation is a program orerase operation, the operation control signal generator generates theoperation end pulse when a pass or a fail of the program or eraseoperation is determined.
 12. The semiconductor memory device of claim 8,wherein, when the target operation is a read operation, the operationcontrol signal generator generates the operation end pulse when fail ofthe read operation is determined or data is read in accordance with theread operation.
 13. The semiconductor memory device of claim 8, whereinthe operation control signal generator transmits the operation end pulseto the temperature detect circuit as the synchronizing signal.
 14. Thesemiconductor memory device of claim 7, wherein the target operationincludes at least one of a program related operation, a read relatedoperation, and an erase related operation for the plurality of memorycells.
 15. The semiconductor memory device of claim 7, wherein thetemperature detect circuit comprises: an enable circuit configured togenerate a temperature detection enable signal configured to control atemperature detect operation for the memory cells in response to thesynchronizing signal; and a detect circuit configured to detecttemperatures of the memory cells in accordance with the temperaturedetection enable signal.
 16. The semiconductor memory device of claim15, wherein the temperature detect circuit comprises an output circuitconfigured to output the detected temperatures of the memory cells tothe controller.
 17. The semiconductor memory device of claim 16, whereinthe enable circuit comprises: an inversion circuit configured to receivethe synchronizing signal, invert the received synchronizing signal, andoutput an inverted synchronizing signal; a selection output circuitconfigured to receive and perform a logic operation on the invertedsynchronizing signal from the inversion circuit and an operation endpulse, and output a resultant signal; and a flip flop configured toreceive the resultant signal and output the temperature detection enablesignal.
 18. The semiconductor memory device of claim 17, wherein theselection output circuit performs an OR operation on the invertedsynchronizing signal from the inversion circuit and the operation endpulse.